Xiaomi’s ambitious journey into developing its own custom chipset began roughly seven years ago with the release of the Surge S1 in the Mi 5c. Although its sequel, the Surge S2, never saw the light of day – perhaps due to the overwhelming challenges involved in creating an entirely in-house silicon solution – Xiaomi’s resolve has been unwavering. According to recent rumors, the company has made significant strides, reportedly completing the tape-out of its first 3nm System on Chip (SoC). However, Xiaomi’s path forward may host several roadblocks worth exploring.
Originating from China, Xiaomi could potentially face trade sanctions that have already affected similar firms. This brings uncertainty about whether Xiaomi can mass-produce its newly designed 3nm chip freely. The latest rumors, initially highlighted by sources like MyDrivers, were confirmed by prominent figures such as Tang Jianguo. During a segment on Beijing Satellite TV, he announced that a tape-out on the 3nm process had been achieved, deeming the milestone a noteworthy event for China’s tech landscape.
Yet, this technological progress might bring about complications. The United States’ trade sanctions have previously prohibited companies like Huawei from engaging with major chip manufacturers like TSMC and Samsung. Such restrictions limit the competitive opportunities for Chinese companies on the global stage. Should Xiaomi’s venture with the 3nm chipset prove successful, it might provide an opportunity for other Chinese firms to incorporate this technology, potentially enhancing their competitive stance.
In terms of timeline, Xiaomi could launch this next-gen chipset as early as the following year. However, specifics remain elusive. It is unclear whether they will utilize TSMC’s N3E or the more advanced N3P process. Additionally, there’s no current information regarding the architecture of the chipset’s CPU or GPU, or whether Xiaomi plans to deploy ARM or develop a custom design.
As of August, there were whispers about Xiaomi releasing a custom SoC in the first half of 2025, possibly manufactured using TSMC’s N4P process. It was suggested that this chip might offer performance on par with Qualcomm’s Snapdragon 8 Gen 1. With such conflicting reports circulating, it’s worthwhile to approach these speculations with skepticism until more concrete details emerge.
Stay tuned for developments as Xiaomi’s plans unfold, and the company navigates the complexities of bringing their custom silicon to market.
