TSMC Chairman C.C. Wei Shares Leadership Lessons as Y.J. Mii Discusses Advanced Chips and AI
TSMC chairman C.C. Wei and co-chief operating officer Y.J. Mii took part in a forum on September 15, 2026, offering National Taiwan University students a rare look inside the thinking that guides one of the world’s most important semiconductor companies.
Appearing by video, Wei spoke to students about the lessons he has learned throughout his journey in education, research and development, and corporate leadership. His message centered on a simple but powerful principle: solving problems starts with putting customers first.
Wei explained that whether in school, technology development, or business management, success often depends on understanding real needs before searching for solutions. For a company like TSMC, which plays a critical role in the global chip supply chain, that mindset has become a key part of its long-term growth.
His remarks highlighted the importance of practical learning, persistence, and adaptability. In the fast-moving semiconductor industry, challenges can come from many directions, including manufacturing complexity, customer demands, global competition, and the rapid rise of artificial intelligence. Wei encouraged students to approach difficult problems with discipline and a willingness to keep learning.
Y.J. Mii continued the conversation with a more technical discussion focused on advanced process technology and the growing role of AI tools in semiconductor development. As chip designs become more complex, artificial intelligence is increasingly being used to improve efficiency, accelerate research, and support next-generation manufacturing.
Mii’s session gave students a closer look at how cutting-edge chip technology is evolving. Advanced process nodes remain essential for faster, more powerful, and more energy-efficient processors used in smartphones, data centers, AI systems, high-performance computing, and other key industries.
The event also reflected the close connection between Taiwan’s academic talent and its semiconductor ecosystem. By engaging directly with students, TSMC’s top leaders emphasized the need for future engineers and researchers who can combine technical skill with problem-solving ability.
The forum offered more than a discussion about chips. It provided insight into the mindset behind TSMC’s success: listen carefully, focus on real-world challenges, continue improving, and keep customers at the center of every decision.
As demand for AI chips and advanced semiconductors continues to grow, the lessons shared by Wei and Mii point to the qualities that will shape the next era of technology leadership: innovation, customer focus, technical excellence, and lifelong learning.
